Description
MX70 Pick and Place System with vision Features:
Vision Centering
Fully automated placing
Automatic fiducials correction and bad mark sensing
Automatic change of nozzles
Automatic feeding of bulk / loose components
Pick & Place data can be entered manually in TEACH-IN mode or can be converted from various CAD data systems
Good price to performance ratio
MX70 Pick and Place System with vision Technical Specifications
PCB Placement area 330 x 500 mm
Feeders 64 feeders of 8 mm tapes + 30 sticks of SO8
Components Range from 0201 to 40 x 40 mm Pitch up to 0.4 mm
Component packing Tapes 8 mm, 12 mm, 16 mm, 24 mm, 32 mm, 44 mm Sticks SO8–PLCC84 Trays Bulk / loose components
Placement rate 2000 – 2400 cph
Placement accuracy Better than 0.08 mm
Nozzle changer Automatic, 8 nozzles, Automatic sensing of nozzle presence
XY resolution 5µm, (linear encoders as standard)
Vision system Automatic fiducial correction, Automatic bad mark sensing, Automatic bulk components feeding, Touchless component centering
Angle resolution 0,05º
Control Panel LCD 17’’ screen, Keyboard, Mouse
Options Data import from CAD, Dispensing head (glue/paste), Tape strips feeder, Bulk / loose components feeder
Dimensions and weight 750 x 1100 x 1350 mm, 150 kg
Power Supply 230 V, 50 Hz, 400 W
Compressed Air Supply 0,6 MPa, 20 l/min